High Thermal Conductivity Silicone Potting Compound Series
Product Description
The High Thermal Conductivity Silicone Potting Compound Series includes 1W, 2W, 3W, and 4W thermally conductive silicone potting compounds.
This series consists of two components, Part A and Part B. Part A is gray-black, while Part B is white. When Part A and Part B are thoroughly mixed at a 1:1 weight ratio or volume ratio, the mixture cures into a gray flexible elastomer.
Product Features
1. Moderate viscosity and excellent flowability, suitable for manual potting or automatic dispensing machines.
2. Adjustable curing speed; can be cured at room temperature or with heat.
3. Excellent thermal conductivity, with thermal conductivity ranging from 1.0 to 4.0 W/m·K, helping improve heat dissipation in electronic devices, capacitors, and other components.
4. Flame retardancy meets UL94 V-0 requirements.
5. Excellent UV resistance and aging resistance after curing.
6. Good elasticity and moderate hardness, providing excellent vibration resistance and waterproof protection.
Applications
Mainly suitable for heat dissipation, flame retardancy, insulation, and protection of electronic and electrical equipment, power supplies, and printed circuit boards (PCBs).
Packaging
50 kg/drum (Part A: 25 kg/drum; Part B: 25 kg/drum)
Customized packaging is available according to customer requirements.
Storage and Transportation
1. Store in a cool, dry, and dark place at temperatures below 25°C. Keep the container tightly sealed.
2. This product is non-flammable and non-explosive and can be transported as general chemical goods. During transportation, protect the product from direct sunlight, compression, and impact to prevent leakage.
3. Shelf life: 6 months when stored under the recommended conditions.
Technical Data:
| Item | Unit | Standard
|
Before Curing |
|
| S3101
| S3202 | S3302 | S3401 |
| Appearance Component A |
| Grayish black | Grayish black | Grayish black | Grayish black |
| Component B |
| White | White | White | White |
| Viscosity 25℃ Component A | MPa.s | 2500±500 | 5000±1000 | 5000±1000 | 17000±2000 |
| Component B | MPa.s | 2500±500 | 5000±1000 | 5000±1000 | 13000±2000 |
| Density Component A | g/cm3 | 1.65±0.05 | 2.80±0.10 | 3.0±0.10 | 3.2±0.20 |
| Component B | g/cm3 | 1.65±0.05 | 2.80±0.10 | 3.0±0.10 | 3.2±0.20 |
| Mixing Ratio | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 |
| Mixing Viscosity | MPa.s | 2500±500 | 5000±1000 | 5000±1000 | 15000±2000 |
| Operating Time 25℃ | h | ＞0.5 | ＞0.5 | ＞0.5 | ＞0.5 |
| Curing Time 25℃ | h | 4±1 | 4±1 | 4±1 | 4±1 |
| Curing Time 60℃ | h | 0.5 | 0.5 | 0.5 | 0.5 |
After Curing | Appearance |
| Grey | Grey | Grey | Grey |
| Density | g/cm3 | 1.65±0.05 | 2.80±0.10 | 3.0±0.10 | 3.2±0.20 |
| Hardness | Shore A | 50±5 | 50±5 | 50±5 | 50±5 |
| Coefficient of Expansion | um/m℃ | ＜190 | ＜150 | ＜110 | ＜100 |
| Dielectric Strength | KV/mm | ≥15 | ≥15 | ≥14 | ≥14 |
| Dielectric Constant 1Hz |
| ≤3.6 | ≤3.6 | ≤3.6 | ≤3.6 |
| Loss Factor 1Hz |
| ≤0.07 | ≤0.07 | ≤0.07 | ≤0.07 |
| Volume Resistivity | Ω.cm | ≥1.0×1014 | ≥1.0×1014 | ≥1.0×1014 | ≥1.0×1014 |
| Thermal Conductivity | W/m.K | 1.0±0.1 | 2.0±0.1 | 3.0±0.2 | 4.0±0.2 |
| Flame Retardancy |
| V-0 | V-0 | V-0 | V-0 |
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