CT-S2151 One-Component Thermally Conductive Silicone Adhesive

Product Description

CT-S2151 is a reinforced, alcohol-cure silicone thermal adhesive. Once cured, it provides excellent bonding and sealing performance on most plastics, glass, ceramics, metals, and other materials, along with good thermal conductivity. It is suitable for bonding heat-generating surfaces to heat-dissipating components.

Product Features

1. Short tack-free time, facilitating easy and efficient application.

2. Good thermal conductivity, with a thermal conductivity of up to 1.0 W/(m·K), making it suitable for heat dissipation in electronic equipment and capacitors.

3. Excellent electrical insulation properties.

4. The cured product offers excellent UV resistance and aging resistance.

5. Excellent resistance to high and low temperatures and thermal shock.

6. Good adhesion performance. The cured product maintains long-term adhesion without detachment and does not form contact gaps that could reduce heat dissipation efficiency.

Applications

Mainly used for filling and bonding between CPUs and heat sinks, thyristor intelligent control modules and heat sinks, and high-power electrical modules and heat sinks.

Packaging

Available in: 300 mL/cartridge, 2.6 L/plastic cartridge

Storage and Transportation

1. Store in a cool, dry and dark place below 25°C and keep the container tightly sealed.

2. This product is non-flammable and non-explosive and can be transported as general chemical goods. During transportation, protect it from direct sunlight, compression and impact to prevent leakage.

3. Shelf life: 6 months under the recommended storage conditions.

Technical Data

Keywords: One-Component Thermally Conductive Silicone Adhesive; Thermally Conductive Silicone Adhesive; Thermal Interface Silicone Adhesive; Thermal Conductive Adhesive for Electronics; Electrically Insulating Thermal Silicone Adhesive