Product Description
CT-E3005 is a two-component epoxy potting compound. Component A is a viscous liquid primarily composed of epoxy resin and functional fillers, while Component B is a transparent modified amine curing agent. The product has good flowability and can be applied by manual pouring or automatic dispensing equipment. After curing, it provides high bonding strength to metals, gold-plated surfaces, silver-plated surfaces, PA+GF and other substrates.
Product Features
1. Moderate viscosity and good flowability, suitable for both manual potting and automatic dispensing.
2. Medium-temperature curing with a short curing time and high bonding strength.
3. Excellent adhesion, providing high bonding strength to gold-plated surfaces, silver-plated surfaces, PA+GF and other substrates.
4. Excellent waterproof sealing performance, achieving up to IP68 protection.
5. Excellent resistance to damp heat aging. After 1,000 hours of 85°C/85% RH testing (85/85 test), the product shows minimal degradation in tensile strength, shear strength and other physical properties.
6. Excellent resistance to high and low temperature thermal shock (-40°C to 105°C). After 1,000 hours of high/low temperature thermal shock testing, no cracking or deformation is observed.
7. Good dielectric properties, including high volume resistivity and dielectric breakdown strength, as well as excellent resistance to electrical tracking.
Applications
Mainly used for aviation connectors, power connectors, EV charging gun sockets, circular connectors, and other electronic components requiring waterproof sealing and protection.
Packaging
30 kg/set; Component A: 25 kg/pail, Component B: 5 kg/pail
Storage and Transportation
1. Store in a cool, dry and dark place below 25°C and keep the container tightly sealed.
2. This product is non-flammable and non-explosive and can be transported as general chemical goods. During transportation, protect it from direct sunlight, compression and impact to prevent leakage.
3. Shelf life: 6 months under the recommended storage conditions.
Technical Data
Item
| Unit | Standard |
Before Curing | Appearance Component A |
| Black viscous liquid |
| Component B |
| Light Yellow Transparent Liquid
|
| Viscosity 25℃ Component A | Mpa.s | 12000±2000 |
| Component B | Mpa.s | 400±50 |
| Density Component A | g/cm³ | 1.50±0.05 |
| Component B | g/cm³ | 1.00±0.05 |
| Mixing Ratio | A: B | 100：20 |
| Mixed Viscosity 25 ℃ | Mpa.s | 3000±500 |
| Operating Time 25 ℃/125g | min | ＞60 |
| GEL Time 25 ℃/125g | h | 2 |
| Curing Time 25℃ | h | 12 |
| Curing Time 80℃ | h | 1 |
After Curing | Density | g/cm³ | 1.45±0.05 |
| Hardness | Shore D | ≥80 |
| Glass Transition Temperature | ℃ | ≥125 |
| Linear Coefficient of Thermal Expansion CTE | μm/m.℃ | 35 |
| Tensile Strength | Mpa | ≥20 |
| Elongation at Break | % | ≥20 |
| Shear Strength AI3003/AI3003 | Mpa | ≥10 |
| Shear Strength PA/PA | Mpa | ＞2 |
| Electric Strength | KV/mm | ≥20 |
| Volume Resistivity | Ω·cm | ≥1.0x1015 |
| Dielectric Constant |
| 3.5 |
| Dielectric Loss | % | 0.7 |
| Thermal Conductivity | W/m.K | 0.6 |
| Relative Leakage Index CTI | V | 600 |
Keywords: Potting Compound, Electronic Potting, Connector Potting, Electronic Encapsulation, Connector Sealing, EV Charging, EV Charging Connector, Automotive Connectors, Power Electronics, EV Technology
