Product description:
CT-S3041 is a two-component addition-type silicone thermal conductive potting glue. Component A is black-gray, component B is white, and it is gray after mixing evenly. This product has low viscosity, low density, small low-temperature shrinkage, and is particularly suitable for instrument potting with hot and cold shock requirements.
Product features:
1. Low density, low viscosity, good fluidity, and easy construction;
2. Good low temperature resistance: After curing, it still has good toughness and no cracking in an environment of -50℃;
3. Good bonding performance, and good adhesion to materials such as titanium alloy, aluminum alloy, stainless steel, and PA;
4. The flame retardant grade reaches UL94-V0;
5. Good dielectric properties, high volume resistivity and electrical breakdown strength;
6. High tensile strength and elongation at break of the body;
7. Good waterproof sealing performance.
Specifications:
1. 40kg/set (Component A: 20kg/barrel, Component B: 20kg/barrel);
2. Customizable according to customer needs.
Storage and transportation:
1. Store in a cool, dry, dark place below 25°C and seal;
2. This product is a non-flammable and explosive material and can be transported as a general chemical. During transportation, it should be protected from exposure, extrusion, and collision to prevent leakage;
3. The shelf life of this product is 6 months.
Application areas:
Mainly suitable for thermally conductive flame-retardant potting and sealing of precision instruments and meters with cold and hot shock requirements.
Item | Unit | Performance | Test method |
Before Curing | Appearance | A component | / | Black-gray | Visual |
B component | / | White | Visual |
Viscosity | A component | MPa·s | 1400±200 | GB/T 2794-2022 |
B component | MPa·s | 1200±200 | GB/T 2794-2022 |
Density | A component | g/cm3 | 1.37±0.05 | GB/T 13354-1992 |
B component | g/cm3 | 1.37±0.05 | GB/T 13354-1992 |
Mixing ratio | A:B | 1 ： 1 | Mass Ratio |
Mix viscosity | MPa·s | 1200±200 | GB/T 2794-2022 |
Pot life, 100g, 25℃ | h | 2±0.5 | / |
Curing condition, 25℃ | h | 24 | / |
Curing condition, 60℃ | h | 1 | / |
After Curing | Appearance | / | Gray | Visual |
Density | g/cm3 | 1.37±0.05 | GB/T 4472-2011 |
Hardness | Shore A | 60±5 | GB/T 531.1-2008 |
Tensile strength | MPa | 2.5±0.5 | / |
Elongation at break | % | 100±20 | GB/T 528 |
Dielectric strength | KV/mm | ≥24 | GB/T 1695-2005 |
| Volume resistivity | Ω·cm | ≥1.6x1015 | GB/T 1692-2008 |
| Thermal conductivity | W/m · K | 0.45 | ASTM D5470 |
| Linear coefficient of thermal expansion | 1/K | 2.5x10-4 |
|
| Dielectric constant |
| 3.2
|
|
| Loss factor | % | 0.07 |
|
| Thermal shock test: -50 to 80℃ |
| There is no cracking with the AI alloy shell |
|
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