Thermally Conductive Potting Compounds provide reliable protection and thermal management for modern power electronics. With enhanced thermal conductivity, these materials efficiently transfer heat away from electronic components, preventing overheating and maintaining stable operation. After curing, the compound forms a durable protective layer with excellent waterproof and moisture-resistant properties, effectively shielding sensitive electronics from humidity and liquid exposure. The fully encapsulated structure also offers strong dustproof performance, protecting devices from dust, dirt, and environmental contaminants.
In addition, the potting compound features flame-retardant performance and excellent electrical insulation, reducing fire risks and preventing electrical leakage or short circuits in high-voltage systems. These properties make it suitable for demanding new energy applications.
Thermally conductive potting materials are widely used in film capacitors to improve heat dissipation and insulation stability, in power inverters to protect power modules and enhance vibration resistance, and in battery modules to support thermal management and improve safety. As a result, they play a key role in ensuring the reliability and efficiency of electric vehicles, energy storage systems, and other new energy technologies.
Technical Parameters
Item | Unit | Performance | Test method |
Before Curing | Appearance | A component | / | Black viscous liquid | Visual |
B component | / | Gray-white liquid | Visual |
Viscosity | A component | mPa·s | 125000±5000 | GB/T 2794-2022 |
B component | mPa·s | 35000±5000 | GB/T 2794-2022 |
Density | A component | g/cm3 | 1.75±0.05 | GB/T 13354-1992 |
B component | g/cm3 | 1.80±0.05 | GB/T 13354-1992 |
Mixing ratio | A:B | 1 ： 1 | Mass Ratio |
Mix viscosity 70℃ | mPa·s | 1500±500 | GB/T 2794-2022 |
Operation time | min | 70 | / |
| After Curing | Density | g/cm3 | 1.80
| GB/T 4472-2011 |
Hardness | Shore D | 100 | GB/T 531.1-2008 |
| Glass transition temperature | ℃ | ≥105 |
|
| Linear expansion coefficient CTE | μm/m.℃ | 27.3 |
|
| Tensile strength | MPa | 41 |
|
| Elongation at break |
| 0.3% |
|
| Flexural strength | MPa | 66 |
|
Dielectric strength | KV/mm | ≥25 | GB/T 1695-2005 |
| Volume resistivity | Ω·cm | ≥1.0x1017 | GB/T 1692-2008 |
| Shear strength |
|
|
|
| Al3003/AI3003 | MPa | ≥6 |
|
| PPS+GF | MPa | ≥5 |
|
| Dielectric constant |
| 3.6 |
|
| Dielectric loss |
| 0.7% |
|
| Water absorption after boiling for 1h |
| ＜0.1% |
|
Thermal conductivity | W/m · K | 0.7-0.9 | ASTM D5470 |
| Comparative leakage index CTI | V | 600 |
|
Flame Retardancy | / | V-0 | UL 94 |
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