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CT-E3006
CYCT
Product Description
CT-E3006 is a two-component epoxy potting compound. Component A is a viscous liquid mainly composed of epoxy resin and functional fillers, while Component B is a transparent modified amine curing agent.
The product offers good flowability and can be applied manually or automatically using a dispensing machine. After curing, it provides high bonding strength to various substrates, including stainless steel, aluminum alloys, PBT, ABS and other materials.
Product Features
Moderate viscosity and excellent flowability: Suitable for both manual potting and automatic dispensing applications.
Room-temperature and heat curing: Can be cured at room temperature or by heating. Low exothermic heat during curing helps prevent damage to individual capacitors.
High bonding strength: Provides excellent adhesion to stainless steel, aluminum alloys, PBT, ABS and other substrates.
Excellent water resistance: After 1,000 hours of 85°C/85% RH testing (85/85 test), the product shows only minor degradation in physical properties such as tensile strength and shear strength.
Excellent resistance to thermal shock: Performs well under temperature cycling from -40°C to 105°C. No cracking or deformation is observed after 1,000 hours of high- and low-temperature thermal shock testing.
Excellent dielectric properties: High volume resistivity and dielectric breakdown strength, providing excellent resistance to electrical tracking and leakage.
Applications
CT-E3006 is primarily designed for waterproof sealing and protection of electronic components, including supercapacitors and capacitors.
Packaging
30 kg/pail: Component A: 24 kg/pail; Component B: 6 kg/pail
Storage and Transportation
1. Store in a cool, dry and dark place at temperatures below 25°C. Keep the container tightly sealed.
2. This product is non-flammable and non-explosive and can be transported as general chemical goods. During transportation, protect the product from direct sunlight, compression and impact to prevent leakage.
3. Shelf life: 6 months under recommended storage conditions.
Technical Data
| Item | Unit | Standard | |
Before Curing | Appearance Component A | Black/blue/yellow viscous liquid | |
| Component B | Transparent Liquid | ||
| Viscosity 25℃ Component A | Mpa.s | 10000±2000 | |
| Component B | Mpa.s | 150±50 | |
| Density Component A | g/cm³ | 1.50±0.05 | |
| Component B | g/cm³ | 1.00±0.05 | |
| Mixing Ratio | A: B | 100:25 | |
| Mixed Viscosity 25 ℃ | Mpa.s | 2500±500 | |
| Operating Time 25 ℃/125g | min | >60 | |
| GEL Time 25 ℃/125g | h | 2 | |
| Curing Time 25℃ | h | 12 | |
| Curing Time 80℃ | h | 1 | |
After Curing | Density | g/cm³ | 1.40±0.05 |
| Hardness | Shore D | ≥80 | |
| Glass Transition Temperature | ℃ | ≥110 | |
| Linear Coefficient of Thermal Expansion CTE | μm/m.℃ | 35 | |
| Tensile Strength | Mpa | ≥30 | |
| Elongation at Break | % | ≥3 | |
| Bending Strength | Mpa | >60 | |
| Shear Strength AI3003/AI3003 | Mpa | ≥10 | |
| Electric Strength | KV/mm | ≥25 | |
| Volume Resistivity | Ω·cm | ≥1.0x1015 | |
| Dielectric Constant | 3.6 | ||
| Dielectric Loss | % | 0.8 | |
| Thermal Conductivity | W/m.K | 0.45-0.65 | |
| Relative Leakage Index CTI | V | 600 | |
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