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CYCT
Our Two-Part Thermally Conductive Potting Compound is a high-performance encapsulant designed for superior heat dissipation in electronic applications. Available in silicone, epoxy, and polyurethane (PU) formulations, this dual-component system offers excellent thermal conductivity while providing robust protection against moisture, chemicals, and mechanical stress.
Key Features:
✔ Efficient Heat Dissipation – Reduces operating temperatures in power electronics, LEDs, and automotive modules
✔ Flexible Material Options – Choose between silicone (flexible), epoxy (rigid), or PU (impact-resistant) based on application needs
✔ Easy 2-Part Mixing – Simple 1:1 or customized ratio for convenient application
✔ High Dielectric Strength – Ensures electrical insulation for sensitive components
✔ Resistant to Harsh Environments – Withstands high temperatures, vibration, and corrosion
Typical Applications:
Power electronics (inverters, converters, motor drives)
LED lighting & automotive electronics
Battery modules & energy storage systems
Industrial control systems & PCB encapsulation
Ideal for engineers seeking long-term reliability and thermal management, our potting compound ensures enhanced durability and performance in demanding conditions.
Available in custom formulations – Contact us for technical specifications & pricing!
Product characteristics
Item(CT-S3062) | Unit | Performance | Test method | |||
Before Curing | Appearance | A component | / | Black-gray | Visual | |
B component | / | White | Visual | |||
Viscosity | A component | mPa·s | 1500-2500 | GB/T 2794-2022 | ||
B component | mPa·s | 1500-2500 | GB/T 2794-2022 | |||
Density | A component | g/cm3 | 1.35±0.05 | GB/T 13354-1992 | ||
B component | g/cm3 | 1.35±0.05 | GB/T 13354-1992 | |||
Mixing ratio | A:B | 1 : 1 | Mass Ratio | |||
Mix viscosity | mPa·s | 1500-2500 | GB/T 2794-2022 | |||
Pot life, 100g, 25℃ | min | 10-60 | / | |||
Curing condition, 25℃ | h | 2-3 | / | |||
Curing condition, 80℃ | min | 15 | / | |||
After Curing | Appearance | / | Gray | Visual | ||
Density | g/cm3 | 1.35±0.05 | GB/T 4472-2011 | |||
Hardness | Shore A | 40±5 | GB/T 531.1-2008 | |||
Dielectric strength | KV/mm | ≥18 | GB/T 1695-2005 | |||
Dielectric constant, 100KHz | / | ≤3.0 | GB/T 1693-2007 | |||
Volume resistivity | Ω·cm | ≥1.0x1013 | GB/T 1692-2008 | |||
Thermal conductivity | W/m · K | 0.6-0.9 | ASTM D5470 | |||
Flame Retardancy | / | V-0 | UL 94 |
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