This high-performance, two-part silicone encapsulant combines excellent thermal conductivity with superior flame retardancy (UL94 V-0 rated), making it ideal for protecting sensitive electronics in demanding environments. The thermally enhanced formulation efficiently dissipates heat from components like power modules, LED assemblies, and PCB boards, while its flame-retardant properties ensure compliance with strict safety standards.
Key Features:
Thermal Conductivity: Reduces hotspots and extends component lifespan
Flame Retardant: Meets UL94 V-0 standards for fire safety
2-Part System: Easy 1:1 mix ratio for convenient application
Low Viscosity: Penetrates tightly spaced components without voids
Room-Temperature Cure: Saves energy and simplifies processing
Flexible After Curing: Absorbs stress from thermal cycling
Applications:
Potting for power electronics (IGBTs, inverters, converters)
LED driver and lighting module encapsulation
Automotive/battery electronics protection
Industrial control systems require fire resistance
With excellent dielectric properties and resistance to moisture/chemicals, this encapsulant provides durable protection while maintaining stable performance in high and low temperatures. The non-corrosive formula is suitable for delicate circuits.
Performance Index
Item | Unit | Performance | Test method |
Before Curing | Appearance | A component | / | Black-gray | Visual |
B component | / | White | Visual |
Viscosity | A component | mPa·s | 2500±500 | GB/T 2794-2022 |
B component | mPa·s | 1500±500 | GB/T 2794-2022 |
Density | A component | g/cm3 | 1.62±0.05 | GB/T 13354-1992 |
B component | g/cm3 | 1.62±0.05 | GB/T 13354-1992 |
Mixing ratio | A:B | 1:1 | Mass Ratio |
Mix viscosity | mPa·s | 1800±500 | GB/T 2794-2022 |
Pot life, 100g, 25℃ | h | 1±0.5 | / |
Surface drying time, 25℃ | h | 4 |
|
Curing condition, 25℃ | h | 12 | / |
Curing condition, 60℃ | h | 0.5 | / |
After Curing | Appearance | / | Gray | Visual |
Density | g/cm3 | 1.62±0.05 | GB/T 4472-2011 |
Hardness | Shore oo | 25±5 | GB/T 531.1-2008 |
Expansion coefficient | μm/(m,℃) | 190 | GB/T 20673-2006 |
Dielectric strength | KV/mm | ≥15 | GB/T 1695-2005 |
Dielectric constant, 1MHz | / | ≤3.7 | GB/T 1693-2007 |
Loss Factor, 1MHz | / | ≤0.08 | GB/T 1693-2007 |
Volume resistivity | Ω·cm | ≥1.0x1014 | GB/T 1692-2008 |
Elongation at break | % | 60 | GB/T 528 |
Thermal conductivity | W/m · K | ≥0.8 | ASTM D5470 |
Flame Retardancy | / | V-0 | UL 94 |
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